The TP series contains silicone rubber with improved thermal
conductivity. It is a ceramic particle filled silicone rubber containing
a highly conforming and thermally conductive thermal pad. It is used
between heat sink and heat generating components. The Ultra soft
version will fill voids and rugged surfaces, while wetting out matting
surfaces in order to efficiently transfer heat from components to
heat sink.
Thermal pad is a silicone-based material with a unique combination of low density, high thermal diffusivity, and low coefficient of thermal expansion.
AOK Tech - Thermal Interface material
Gap filler Pad TP Series
This information and our technical advice – whether verbal, in writing or by way of trials – are given in good faith but without warranty, and this also applies where proprietary rights of third parties are involved. Our advice
does not release you from the obligation to check its validity and to test our products as to their suitability for the intended processes and uses. The application, use and processing of our products and the products
manufactured by you on the basis of our technical advice are beyond our control and, therefore, entirely your own responsibility. Our products are sold in accordance with our General Conditions of Sale and Delivery.
Products Benefits
- Improved thermal conductivity
- Ultrasoft is highly compressible
- Provides good wetting
- Self-tacky or additional PSA available
- Convenient packaging
Thermally Conductive Gap Filler product Line
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