Gap Filler Pad Thermal Interface Material

Gap Filler Pad Thermal Interface Material for Silicone-Sensitive Electronic ApplicationsThe AOK Tech Company, a supplier of thermal management materials, has released Gap Filler TP500, now provides silicone-free thermal interface materials with a new light tack adhesive to provide high thermal conductivity where contamination threats prevent the use of silicone-based thermal pads.

a new “low volatility, two-component, liquid-dispensable thermal interface material that offers the high temperature resistance and low modulus of a silicone material with minimal outgassing.” According to the company, the new gap filler pad is ideal for use with fragile components and for filling unique and intricate air voids and gaps.

“Unlike precured gap filling materials, liquid dispensed materials offer infinite thickness options and eliminate the need for specific pad thicknesses or die-cut shapes for individual applications. Gap Filler TP500 is specifically designed with shear thinning characteristics to support optimized dispensing,” the company said. Gap Filler tp500 offers a thermal conductivity of 5.0 W/mk.

The Main Difference of AOK Brand Thermal Gap Fillers