Thermal Gap Pad Plays High-Performance Cooling For Electronics

The need for new cooling techniques is driven by the continuing increases in power dissipation of electronic parts and systems.Poor thermal management leads to more than 50% of electronic failures. The failure rate for electronics increases exponentially with the increase in junction temperature. Specifically, the failure rate of an electronic device doubles with every 10°C increase in chip junction temperature. The ability to transfer and dissipate heat generated at the chip level directly affects the system's reliability.

In many instances standard techniques cannot achieve the required cooling performance due to physical limitations in heat transfer capabilities. These limitations are principally related to the limited thermal conductivity of air for convection and copper for conduction. Thermal Gap Filler Pad is designed to be used in the applications that require the minimum amount of pressure on components and moderate thermal conductivity.

AOK technolgoies supplies Thermally Conductive pads and gaskets in standard and made-to-drawing configurations from a variety of Gap Filling products.

Gap filler Pad TP Series

The TP series contains silicone rubber with improved thermal
conductivity. It is a ceramic particle filled silicone rubber containing
a highly conforming and thermally conductive thermal pad. It is used
between heat sink and heat generating components. The Ultra soft
version will fill voids and rugged surfaces, while wetting out matting
surfaces in order to efficiently transfer heat from components to
heat sink.
Thermal pad is a silicone-based material with a unique combination of low density, high thermal diffusivity, and low coefficient of thermal expansion. 

AOK Tech - Thermal Interface material

Gap filler Pad TP Series

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does not release you from the obligation to check its validity and to test our products as to their suitability for the intended processes and uses. The application, use and processing of our products and the products
manufactured by you on the basis of our technical advice are beyond our control and, therefore, entirely your own responsibility. Our products are sold in accordance with our General Conditions of Sale and Delivery.

Products Benefits
- Improved thermal conductivity
- Ultrasoft is highly compressible
- Provides good wetting
- Self-tacky or additional PSA available
- Convenient packaging

Thermally Conductive Gap Filler product Line

Gap Filler Pad Thermal Interface Material

Gap Filler Pad Thermal Interface Material for Silicone-Sensitive Electronic ApplicationsThe AOK Tech Company, a supplier of thermal management materials, has released Gap Filler TP500, now provides silicone-free thermal interface materials with a new light tack adhesive to provide high thermal conductivity where contamination threats prevent the use of silicone-based thermal pads.

a new “low volatility, two-component, liquid-dispensable thermal interface material that offers the high temperature resistance and low modulus of a silicone material with minimal outgassing.” According to the company, the new gap filler pad is ideal for use with fragile components and for filling unique and intricate air voids and gaps.

“Unlike precured gap filling materials, liquid dispensed materials offer infinite thickness options and eliminate the need for specific pad thicknesses or die-cut shapes for individual applications. Gap Filler TP500 is specifically designed with shear thinning characteristics to support optimized dispensing,” the company said. Gap Filler tp500 offers a thermal conductivity of 5.0 W/mk.

The Main Difference of AOK Brand Thermal Gap Fillers